US Patent Issued to APR Technologies on Nov. 25 for "Cooling of electronic components with an electrohydrodynamic flow unit" (Swedish Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,186, issued on Nov. 25, was assigned to APR Technologies AB (Sweden).

"Cooling of electronic components with an electrohydrodynamic flow unit" was invented by Are Bjorneklett (Vasteras, Sweden), Peter Nilsson (Sundbyberg, Sweden) and Robert Thorslund (Sigtuna, Sweden).

According to the abstract* released by the U.S. Patent & Trademark Office: "An arrangement for thermal management is disclosed, wherein a heat generating component is arranged within an enclosure, defined by an enclosure wall and in thermal contact with a thermal management fluid. The arrangement comprises an electrohydrodynamic flow unit, comprising a first and a second electrode, for controlling the flow of fluid...