US Patent Issued to APPLIED MATERIALS on Sept. 9 for "Single side via fill process for through-vias" (California, Montana Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,810, issued on Sept. 9, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Single side via fill process for through-vias" was invented by Marvin Louis Bernt (Whitefish, Mont.) and Jon Woodyard (Livermore, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus for single side filling of through-vias in a substrate are provided herein. In some embodiments, a method of filling through-vias in a substrate includes: coupling a first side of the substrate having through-vias to a carrier plate with an adhesive layer; exposing the through-vias to a conductive layer disposed between the carrier plate and the first side of t...