ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,410,513, issued on Sept. 9, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Seamless gapfill of metal nitrides" was invented by Subramanian Tamilmani (Fremont, Calif.), Srinivas Gandikota (Santa Clara, Calif.), Jianqiu Guo (San Jose, Calif.) and Luping Li (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for filling a substrate feature with a seamless metal gate fill are described. Methods comprise sequentially depositing a film on a substrate surface having at least one feature thereon. The at least one feature extends a feature depth from the substrate surface to a bottom surface and has a width defined by a f...