US Patent Issued to Applied Materials on Sept. 9 for "Electrostatic chucks with hybrid pucks to improve thermal performance and leakage current stability" (Indian Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,769, issued on Sept. 9, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Electrostatic chucks with hybrid pucks to improve thermal performance and leakage current stability" was invented by Yogananda Sarode (Bangalore, India), Anand Kumar (Bengaluru, India) and Prashant V. Javali (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a hybrid puck corresponding to an electrostatic chuck. The hybrid puck includes a backing region and a chucking region disposed on the backing region. The backing region includes a first dielectric material to improve thermal performance of the hybrid puck. The chucking region ...