US Patent Issued to APPLIED MATERIALS on Sept. 30 for "Composite structures for semiconductor process chambers" (California Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,338, issued on Sept. 30, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Composite structures for semiconductor process chambers" was invented by Tianshu Li (Santa Clara, Calif.), Yikai Chen (Santa Clara, Calif.), Aniruddha Pal (Santa Clara, Calif.), Yao-Hung Yang (Santa Clara, Calif.) and Saurabh M. Chaudhari (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a part for a process chamber incorporates a substrate core in the part. The method may include performing a silicon carbide (SIC) deposition process on a substrate to form a SiC coating of approximately 1 mm to approximately 2 mm on all sid...