ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,413, issued on Sept. 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Substrate support with real time force and film stress control" was invented by Wendell Glenn Boyd Jr. (Morgan Hill, Calif.), Govinda Raj (Santa Clara, Calif.) and Matthew James Busche (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure provide a method for processing a substrate disposed on a substrate support. The method includes chucking a substrate to a substrate support, monitoring a chucking force on the substrate with a sensor disposed in a backside gas hole of the substrate support, wherein the sensor...