US Patent Issued to Applied Materials on Sept. 23 for "Substrate defect analysis" (California Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,378, issued on Sept. 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Substrate defect analysis" was invented by Seng Keong Lim (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes identifying property data of a substrate processed by a substrate processing system. The method further includes identifying, based on a first subset of the property data, a plurality of regions of the substrate corresponding to a first defect category. The method further includes sub-categorizing, based on a second subset of the property data, the plurality of regions of the substrate corresponding to the first defect categ...