US Patent Issued to Applied Materials on Sept. 23 for "Semiconductor processing system with a manifold for equal splitting and common divert architecture" (Indian, American Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,414, issued on Sept. 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Semiconductor processing system with a manifold for equal splitting and common divert architecture" was invented by Arun Chakravarthy Chakravarthy (Panruti, India), Vinay K. Prabhakar (Fremont, Calif.), Dharma Ratnam Srichurnam (Hyderabad, India) and Hossein Rezvantalab (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary substrate processing systems may include a lid plate. The systems may include a gas splitter seated on the lid plate. The gas splitter may include a top surface and side surfaces. The gas splitter may define a first and...