ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,481, issued on Sept. 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Modular substrate support assembly" was invented by Arvinder Manmohan Singh Chadha (San Jose, Calif.), Vijay D. Parkhe (San Jose, Calif.), Glen T Mori (Gilroy, Calif.) and Christopher Laurent Beaudry (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck assembly includes a first puck plate including one or more first functional elements, a second puck plate including one or more second functional elements, and an interface layer at least partially bonding the first puck plate and the second puck plate."
The patent was filed on ...