US Patent Issued to Applied Materials on Sept. 23 for "Control of processing parameters during substrate polishing using cost function" (California Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,373, issued on Sept. 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Control of processing parameters during substrate polishing using cost function" was invented by Benjamin Cherian (San Jose, Calif.) and Sivakumar Dhandapani (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Controlling a polishing system includes receiving from an in-situ monitoring system, for each region of a plurality of regions on a substrate being processed by the polishing system, a sequence of characterizing values for the region. For each region, a polishing rate is determined for the region, and an adjustment is calculated for at least o...