ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,998, issued on Sept. 16, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).
"Procedure to enable die rework for hybrid bonding" was invented by Ying Wang (Singapore) and Guan Huei See (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of bonding one or more dies to a substrate are provided herein. In some embodiments, a method of bonding one or more dies to a substrate includes: applying a material coating on the one or more dies or the substrate; placing the one or more dies on the substrate so that the one or more dies temporarily adhere to the substrate via surface tension or tackiness of the material coating; inspectin...