US Patent Issued to Applied Materials on Sept. 16 for "Physical vapor deposition source and chamber assembly" (Indian, American Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,903, issued on Sept. 16, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Physical vapor deposition source and chamber assembly" was invented by Sathiyamurthi Govindasamy (Coimbatore, India), Harish V. Penmethsa (Dublin, Calif.), Suresh Palanisamy (Coimbatore, India), Naresh Kumar Asokan (Coimbatore, India) and Karunakaran Nataraj (Coimbatore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus and methods for improving film uniformity in a physical vapor deposition (PVD) process are provided herein. In some embodiments, a magnetron translation assembly comprises a first linear actuator assembly with a first rail which is a...