US Patent Issued to Applied Materials on Sept. 16 for "Atomic layer self aligned substrate processing and integrated toolset" (California Inventor)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,080, issued on Sept. 16, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Atomic layer self aligned substrate processing and integrated toolset" was invented by Suketu Arun Parikh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus and methods to process one or more wafers are described. A substrate is exposed to a plurality of process stations to deposit, anneal, treat and optionally etch a film in small increments to provide self-aligned growth of the film on a substrate surface."

The patent was filed on Sept. 14, 2021, under Application No. 17/474,196.

*For further information, including images, charts and ...