US Patent Issued to Applied Materials on Oct. 28 for "Substrate handling systems and methods for CMP processing" (Indian, American Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,454,036, issued on Oct. 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Substrate handling systems and methods for CMP processing" was invented by Jeonghoon Oh (Saratoga, Calif.), Manoj A. Gajendra (Bangalore, India), John Anthony Garcia (San Jose, Calif.), Chetan Kumar Mylappanahalli Narasingaiah (Bangalore, India), Sanjay Bhanurao Chavan (Bangalore, India), Gagan Dobhal (Bangalore, India), Manoj Balakumar (Bangalore, India), Jamie Stuart Leighton (Palo Alto, Calif.) and Van H. Nguyen (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system and method for sequential single-sided CMP processing of opposite facing surf...