US Patent Issued to Applied Materials on Oct. 28 for "Semiconductor processing chambers and methods for deposition and etch" (Indian, American Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,602, issued on Oct. 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Semiconductor processing chambers and methods for deposition and etch" was invented by Khokan Chandra Paul (Cupertino, Calif.), Ravikumar Patil (Karnataka, India), Vijet Patil (Bangalore, India), Carlaton Wong (Sunnyvale, Calif.), Adam J. Fischbach (Campbell, Calif.), Timothy Franklin (Campbell, Calif.), Tsutomu Tanaka (Santa Clara, Calif.) and Canfeng Lai (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary semiconductor substrate supports may include a pedestal shaft. The semiconductor substrate supports may include a platen. The platen may ...