US Patent Issued to Applied Materials on Oct. 28 for "Method for testing a packaging substrate, and apparatus for testing a packaging substrate" (German Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,455,313, issued on Oct. 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Method for testing a packaging substrate, and apparatus for testing a packaging substrate" was invented by Bernhard G. Mueller (Finsing, Germany), Axel Wenzel (Augsburg, Germany), Nikolai Knaub (Munich) and Georg Jost (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for testing a packaging substrate with at least one electron beam column is described, wherein the packaging substrate is a panel level packaging substrate or an advanced packaging substrate. The method includes placing the packaging substrate on a stage in a vacuum chamber; directing at...