US Patent Issued to Applied Materials on Oct. 21 for "Compensation for slurry composition in in-situ electromagnetic inductive monitoring" (California Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,576, issued on Oct. 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Compensation for slurry composition in in-situ electromagnetic inductive monitoring" was invented by Kun Xu (Sunol, Calif.) and Andrew Siordia (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of chemical mechanical polishing includes bringing a conductive layer of a substrate into contact with a polishing pad, supplying a polishing liquid to the polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer ...