US Patent Issued to Applied Materials on Oct. 14 for "Nanocrystalline diamond with amorphous interfacial layer" (Singaporean, American Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,104, issued on Oct. 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Nanocrystalline diamond with amorphous interfacial layer" was invented by Sze Chieh Tan (Singapore), Vicknesh Sahmuganathan (Singapore), Christian W. Valencia (Alhambra, Calif.), Thai Cheng Chua (Cupertino, Calif.), Masahiro Kawasaki (San Jose, Calif.), Jenn-Yue Wang (Santa Clara, Calif.) and John Sudijono (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of depositing a nanocrystalline diamond film are described. The method may be used in the manufacture of integrated circuits. Methods include treating a substrate with a plasma to form a treated s...