US Patent Issued to Applied Materials on Nov. 4 for "Cathode assembly for integration of embedded electrostatic chuck (ESC)" (Singaporean, Indian Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,075, issued on Nov. 4, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Cathode assembly for integration of embedded electrostatic chuck (ESC)" was invented by Karthik Elumalai (Singapore), Arunkumar Tatti (Haveri, India), Muhammad Danial Bin Mohamed Yunos (Singapore), Eng Sheng Peh (Singapore), Cheng Sun (Singapore) and Ye Y Liu (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include an apparatus that includes an electrostatic chuck (ESC). The electrostatic chuck may include a first body that is electrically conductive, and a ceramic insert on the first body with an electrode embedded within the c...