US Patent Issued to Applied Materials on Nov. 4 for "Carbon and boron implantation for backside chemical mechanical planarization control" (Massachusetts Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,038, issued on Nov. 4, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Carbon and boron implantation for backside chemical mechanical planarization control" was invented by Yan Zhang (Westford, Mass.), Johannes M. van Meer (Middleton, Mass.), Jae Young Lee (Bedford, Mass.) and Naushad Variam (Marblehead, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a workpiece that will include a backside power delivery network is disclosed. The method includes forming a CMP marker layer in the workpiece at the depth to which the workpiece is to be thinned. This CMP marker layer, which may be a boron-rich layer, serves to...