ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,736, issued on Nov. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Semiconductor device packages" was invented by Steven Verhaverbeke (San Francisco) and Han-Wen Chen (Cupertino, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor device package. In certain embodiments, a glass or silicon substrate is patterned by laser ablation to form structures for subsequent formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor device package, which may have one or more embedd...