US Patent Issued to Applied Materials on Nov. 25 for "Method for forming integrated circuit structures" (California Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,652, issued on Nov. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Method for forming integrated circuit structures" was invented by Bhargav Sridhar Citla (Fremont, Calif.), Joshua Alan Rubnitz (Monte Sereno, Calif.), Jethro Tannos (San Jose, Calif.), Srinivas D. Nemani (Saratoga, Calif.), Kartik Ramaswamy (San Jose, Calif.) and Yang Yang (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus for forming an integrated circuit structure, comprising: delivering a process gas to a process volume of a process chamber; applying low frequency RF power to an electrode formed from a high secondary electro...