US Patent Issued to Applied Materials on Nov. 18 for "Modular mainframe layout for supporting multiple semiconductor process modules or chambers" (Montana, California Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,120, issued on Nov. 18, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Modular mainframe layout for supporting multiple semiconductor process modules or chambers" was invented by Randy A. Harris (Kalispell, Mont.), Coby Scott Grove (Whitefish, Mont.), Paul Zachary Wirth (Kalispell, Mont.), Avinash Shantaram (Whitefish, Mont.), Alpay Yilmaz (San Jose, Calif.), Amir Nissan (Sunnyvale, Calif.), Jitendra Ratilal Bhimjiyani (Santa Clara, Calif.), Niranjan Pingle (Milpitas, Calif.) and Vincent Dicaprio (Pleasanton, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus for bonding chiplets to substrates are provided he...