US Patent Issued to APPLIED MATERIALS on Nov. 11 for "Wafer to baseplate arc prevention using textured dielectric" (California Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,733, issued on Nov. 11, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Wafer to baseplate arc prevention using textured dielectric" was invented by Arvinder S. Chadha (San Jose, Calif.) and Kartik Ramaswamy (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electrostatic chucks for use in substrate processing chambers are provided herein. In some embodiments, an electrostatic chuck for use in a substrate processing chamber includes: a dielectric plate having an electrode disposed therein, the dielectric plate further including a central portion and a peripheral portion, wherein the peripheral portion comprises at least ...