ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,740, issued on Nov. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Vacuum chucking of a substrate within a carrier" was invented by James D. Strassner (Austin, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate carrier and methods of assembling the substrate carrier are described herein. The substrate carrier includes a plurality of vacuum transfer channels to vacuum chuck a bottom of a substrate. The plurality of vacuum transfer channels reduce the radial position of the vacuum to enable vacuum chucking of the substrate from a radially outward vacuum position to an inward vacuum position. The substrate is positione...