US Patent Issued to Applied Materials on Nov. 11 for "Systems and methods for predicting film thickness using virtual metrology" (Indian Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,468,873, issued on Nov. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Systems and methods for predicting film thickness using virtual metrology" was invented by Debkalpo Das (Chennai, India), Raman K. Nurani (Chennai, India), Ramachandran Subramanian (Chennai, India), Bibhavendra Singh (Lucknow, India) and Bharath Sundar (Chennai, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes obtaining sensor data associated with a deposition process performed in a process chamber to deposit film on a surface of a substrate. A plurality of physics-based outputs are generated using a transformation function and the sensor dat...