US Patent Issued to Applied Materials on Nov. 11 for "Electroplating wetting chamber with reduced bubble entrapment" (Montana Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,720, issued on Nov. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Electroplating wetting chamber with reduced bubble entrapment" was invented by Kyle M. Hanson (Kalispell, Mont.), Eric J. Bergman (Kalispell, Mont.), Gregory J. Wilson (Kalispell, Mont.), Paul R. McHugh (Kalispell, Mont.), Benjamin Clay Bradley (Kalispell, Mont.), Aaron Paul Juntunen (Kalispell, Mont.), Deepak Saagar Kalaikadal (Kalispell, Mont.), Daniel Durado (Kalispell, Mont.), Carl Campbell Stringer (Whitefish, Mont.), James Jay Tripp (Kalispell, Mont.), Jason A. Rye (Kalispell, Mont.) and John L. Klocke (Kalispell, Mont.).

According to the abstract* released by the U.S. Patent & Trademark ...