US Patent Issued to APPLIED MATERIALS on May 6 for "Using controlled gas pressure for backside wafer support" (California Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,934, issued on May 6, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Using controlled gas pressure for backside wafer support" was invented by Paul Steffas (Santa Clara, Calif.) and Kenneth S. Ledford (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein provide substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on one or more surfaces of the substrate without contacting the one or more devices and preventing changes in profile of the substrate. The substrate support assembly allows for control of the substrate. The substrate support assembly...