ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,733, issued on May 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Enhanced etch selectivity using halides" was invented by David Knapp (Santa Clara, Calif.), Feng Qiao (San Jose, Calif.), Hailong Zhou (San Jose, Calif.), Junkai He (San Jose, Calif.), Qian Fu (Pleasanton, Calif.), Mark J. Saly (Santa Clara, Calif.), Jeffrey Anthis (Redwood City, Calif.) and Jayoung Choi (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes performing a dry etch process to remove a portion of a first layer disposed on a second layer of a stack of alternating layers. The first layer includes a first material and the seco...