US Patent Issued to Applied Materials on May 27 for "Bottom cover plate to reduce wafer planar nonuniformity" (Indian, American Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,746, issued on May 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Bottom cover plate to reduce wafer planar nonuniformity" was invented by Zubin Huang (Santa Clara, Calif.), Srinivas Tokur Mohana (Bangalore, India), Sandesh Yadamane (Bangalore, India), Kai Wu (Palo Alto, Calif.), Jallepally Ravi (San Ramon, Calif.), Xiaozhou Yu (Santa Clara, Calif.) and Peiqi Wang (Campbell, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure provided herein generally relate to a bottom cover plate (BCP) that enables control of radiation loss from a heating element inside a chamber for processing a substrate. The h...