ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,888, issued on May 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Heated substrate support" was invented by Govinda Raj (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heater for a semiconductor processing chamber is disclosed that includes a ceramic body, and a resistive heating element embedded in the ceramic body, the resistive heating element disposed in a heater coil having an inner central sector and an outer central sector, the inner central sector having a plurality of first peaks and the outer central sector having a plurality of second peaks, wherein the number of first peaks is less than about fif...