US Patent Issued to Applied Materials on May 13 for "Encapsulation materials for flat optical devices" (Indian, American Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,367, issued on May 13, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Encapsulation materials for flat optical devices" was invented by Srobona Sen (Mumbai, India), Tapashree Roy (Bangalore, India), Prerna Sonthalia Goradia (Mumbai, India) and Robert Jan Visser (Menlo Park, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein relate to flat optical devices and encapsulation materials for flat optical devices. One or more embodiments include a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having...