US Patent Issued to APPLIED MATERIALS on May 13 for "Electrostatic chuck for high bias radio frequency (RF) power application in a plasma processing chamber" (California Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,473, issued on May 13, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Electrostatic chuck for high bias radio frequency (RF) power application in a plasma processing chamber" was invented by Jaeyong Cho (San Jose, Calif.), Shahid Rauf (Pleasanton, Calif.) and Peng Tian (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of an electrostatic chuck are provided herein. In some embodiments, an electrostatic chuck for use in a substrate processing chamber includes a plate having a first side and a second side opposite the first side, a first electrode embedded in the plate proximate the first side, a second electr...