US Patent Issued to Applied Materials on May 13 for "Apparatus and method for CMP temperature control" (California Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,427, issued on May 13, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Apparatus and method for CMP temperature control" was invented by Haosheng Wu (San Jose, Calif.), Shou-Sung Chang (Mountain View, Calif.), Chih Chung Chou (San Jose, Calif.), Jianshe Tang (San Jose, Calif.), Hui Chen (San Jose, Calif.), Hari Soundararajan (Sunnyvale, Calif.) and Brian J. Brown (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit an...