US Patent Issued to Applied Materials on March 25 for "Selective etch of a substrate" (California Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,049, issued on March 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Selective etch of a substrate" was invented by David Thompson (Santa Clara, Calif.), Bhaskar Jyoti Bhuyan (Santa Clara, Calif.), Mark Saly (Santa Clara, Calif.), Lisa Enman (Santa Clara, Calif.), Aaron Dangerfield (Santa Clara, Calif.), Jesus Candelario Mendoza (Santa Clara, Calif.), Jeffrey W. Anthis (Santa Clara, Calif.) and Lakmal Kalutarage (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is a method for selectively cleaning and/or etching a sample. The method includes selectively forming a film in a trench of a substrate ...