US Patent Issued to Applied Materials on March 25 for "Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer" (California Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,664, issued on March 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer" was invented by Kevin H. Song (San Jose, Calif.) and Benedict W. Pang (Burlingame, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing pad for a chemical mechanical polishing apparatus includes a polishing layer having a polishing surface and a backing layer formed of a fluid-permeable material. The backing layer includes a lower surface configured to be secured to a platen and an upper surface secured to the polishing layer, wherein the lower surface...