ALEXANDRIA, Va., March 19 -- United States Patent no. 12,251,788, issued on March 18, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).
"Polishing head with local wafer pressure" was invented by Andrew Nagengast (Sunnyvale, Calif.), Steven M. Zuniga (Soquel, Calif.), Jay Gurusamy (Santa Clara, Calif.), Charles C. Garretson (Sunnyvale, Calif.) and Vladimir Galburt (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the ...