ALEXANDRIA, Va., March 19 -- United States Patent no. 12,251,787, issued on March 18, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Modular chemical mechanical polisher with simultaneous polishing and pad treatment" was invented by Steven M. Zuniga (Soquel, Calif.) and Jay Gurusamy (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed towards polishing modules for performing chemical mechanical polishing of a substrate. The substrate may be a semiconductor substrate. The polishing modules described have a plurality of pads, such as polishing pads, disposed within a single polishing station. The pads are configured to remain stationary during p...