US Patent Issued to Applied Materials on March 18 for "Methods to eliminate of deposition on wafer bevel and backside" (Indian, American Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,054, issued on March 18, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Methods to eliminate of deposition on wafer bevel and backside" was invented by Venkata Sharat Chandra Parimi (Sunnyvale, Calif.), Zubin Huang (Santa Clara, Calif.), Manjunath Veerappa Chobari Patil (Karnataka, India), Nitin Pathak (Mumbai, India), Yi Yang (San Jose, Calif.), Badri N. Ramamurthi (Los Gatos, Calif.), Truong Van Nguyen (Milpitas, Calif.), Rui Cheng (San Jose, Calif.) and Diwakar Kedlaya (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary semiconductor processing chambers include a chamber body defining a processing region. T...