US Patent Issued to Applied Materials on June 3 for "Apparatus and method for CMP temperature control" (California Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,318,882, issued on June 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Apparatus and method for CMP temperature control" was invented by Shou-Sung Chang (Mountain View, Calif.), Hari Soundararajan (Sunnyvale, Calif.), Haosheng Wu (San Jose, Calif.) and Jianshe Tang (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the plate...