US Patent Issued to Applied Materials on June 17 for "Simulation of atomistic defects in nanoelectronics using polyhedral meshes" (Italian Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,333,233, issued on June 17, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Simulation of atomistic defects in nanoelectronics using polyhedral meshes" was invented by Luca Vandelli (Scandiano, Italy), Matteo Bertocchi (Mirandola, Italy), Stefano Dominici (Parma, Italy) and Luca Larcher (Reggio Emilia, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A simulation of an electronic device may use a distribution of atomistic defects to provide more accurate results. An input mesh may be received representing a physical structure of the electronic device. This input mesh may be transformed into a polyhedral mesh to facilitate the simulati...