US Patent Issued to APPLIED MATERIALS on June 17 for "Methods and apparatus for selective etch stop capping and selective via open for fully landed via on underlying metal" (California Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,394, issued on June 17, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Methods and apparatus for selective etch stop capping and selective via open for fully landed via on underlying metal" was invented by Suketu Parikh (San Jose, Calif.), Mihaela A. Balseanu (Santa Clara, Calif.), Bhaskar Jyoti Bhuyan (Milpitas, Calif.), Ning Li (San Jose, Calif.), Mark Joseph Saly (Milpitas, Calif.), Aaron Michael Dangerfield (San Jose, Calif.), David Thompson (Santa Clara, Calif.) and Abhijit B. Mallick (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus for processing a substrate are provided herein. For example,...