US Patent Issued to Applied Materials on June 17 for "Cooled substrate support assembly for radio frequency environments" (American, Swiss Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,315, issued on June 17, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Cooled substrate support assembly for radio frequency environments" was invented by Vijay D. Parkhe (San Jose, Calif.), Andreas Schmid (Meyriez, Switzerland), Andrew Antoine Noujaim (Morgan Hill, Calif.), Stephen Donald Prouty (San Jose, Calif.), Alvaro Garcia De Gorordo (San Francisco) and Martin Perez-Guzman (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate support assembly is described herein that includes a facility plate, a ground plate coupled to the facility plate, a fluid conduit disposed within the substrate support assembly dis...