US Patent Issued to Applied Materials on June 10 for "Cooling flow in substrate processing according to predicted cooling parameters" (American, Indian Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,326,282, issued on June 10, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Cooling flow in substrate processing according to predicted cooling parameters" was invented by Ala Moradian (San Jose, Calif.), Umesh Kelkar (Cupertino, Calif.), Orlando Trejo (Livermore, Calif.), Elizabeth Kathryn Neville (Redwood City, Calif.) and Karthik Ramanathan (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Technologies directed to cooling flow according to predicted cooling parameters for substrate processing are described. In some embodiments, a method includes receiving first data indicative of a process recipe for processing a substra...