US Patent Issued to Applied Materials on July 29 for "System architecture of manufacturing of semiconductor wafers" (California Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,874, issued on July 29, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"System architecture of manufacturing of semiconductor wafers" was invented by Dmitry Lubomirsky (Cupertino, Calif.), Huixiong Dai (San Jose, Calif.) and Ellie Y. Yieh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A post lithography resist treatment apparatus for treating a substrate having a resist layer thereon with a fluid layer thereover includes at least one post exposure bake chamber having a substrate support having a substrate support surface thereon, and an electrode, the electrode comprising an electrode body having a substrate support ...