US Patent Issued to Applied Materials on July 29 for "Polishing apparatus using machine learning and compensation for pad thickness" (American, Russian Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,370,646, issued on July 29, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Polishing apparatus using machine learning and compensation for pad thickness" was invented by Kun Xu (Sunol, Calif.), Denis Ivanov (St. Petersburg, Russia), Harry Q. Lee (Los Altos, Calif.) and Jun Qian (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Data received from an in-situ monitoring system includes, for each scan of a sensor, a plurality of measured signal values for a plurality of different locations on a layer. A thickness of a polishing pad is determined based on the data from the in-situ monitoring system. For each scan, a portion of...