US Patent Issued to Applied Materials on July 15 for "Method and apparatus for laser drilling blind vias" (California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,358,073, issued on July 15, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Method and apparatus for laser drilling blind vias" was invented by Wei-Sheng Lei (San Jose, Calif.), Kurtis Leschkies (San Jose, Calif.), Roman Gouk (San Jose, Calif.), Steven Verhaverbeke (San Francisco) and Visweswaren Sivaramakrishnan (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer is provided. The method includes detecting the mask layer by a sensor, the mask layer providing a substrate surface; determining a p...