US Patent Issued to Applied Materials on July 15 for "Dynamic generation of layout adaptive packaging" (California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,360,467, issued on July 15, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Dynamic generation of layout adaptive packaging" was invented by Uwe Hollerbach (Fremont, Calif.) and Thomas L. Laidig (Richmond, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections."

The patent was filed on Nov. 29, 2023, under Application No. 18/523,620.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1...