ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,211, issued on July 15, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).
"Detecting defects of semiconductor manufacturing assemblies" was invented by Yao-Hung Yang (Santa Clara, Calif.), Chih-Yang Chang (Santa Clara, Calif.) and Shannon Wang (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of determining an operational status of a semiconductor manufacturing assembly uses internal vibrations of an in-situ assembly to detect defects. The method may include initiating a first test vibration in an internal structure of the semiconductor manufacturing assembly while the semiconductor manufacturing assembly is in...