US Patent Issued to Applied Materials on July 1 for "Electrostatic chuck assembly for cryogenic applications" (California Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,659, issued on July 1, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Electrostatic chuck assembly for cryogenic applications" was invented by Vijay D. Parkhe (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure generally relate to an electrostatic chuck assembly suitable for use in cryogenic applications. In one or more embodiments, an electrostatic chuck assembly is provided and includes an electrostatic chuck having a substrate supporting surface opposite a bottom surface, a cooling plate having a top surface, where the cooling plate contains an aluminum alloy having a coefficient o...